Inkqubo yemveliso yeIzibane zezibane ze-LEDlikhonkco eliphambili kwishishini lokukhanyisa i-LED. Ubuhlalu bokukhanya kwe-LED, okwakwaziwa ngokuba zii-diode zokukhanya, zizinto ezibalulekileyo ezisetyenziswa kwizicelo ezahlukeneyo ukusuka kwizibane zokuhlala ukuya kwizisombululo zokukhanyisa iimoto kunye nezoshishino. Kwiminyaka yakutshanje, ngenxa yeenzuzo zokonga amandla, ubomi obude, kunye nokukhuselwa kokusingqongileyo kwamaso isibane se-LED, imfuno yabo iye yanda kakhulu, ekhokelela kwinkqubela phambili kunye nokuphuculwa kobugcisa bemveliso.
Inkqubo yokuvelisa izibane zesibane se-LED ibandakanya izigaba ezininzi, ukusuka ekwenziweni kwezixhobo ze-semiconductor ukuya kwindibano yokugqibela yee-chips ze-LED. Inkqubo iqala ngokukhethwa kwezinto ezicocekileyo ezifana ne-gallium, i-arsenic, kunye ne-phosphorus. Ezi zixhobo zidibaniswe ngomlinganiselo ochanekileyo ukwenza iikristale ze-semiconductor ezenza isiseko sobuchwepheshe be-LED.
Emva kokuba i-semiconductor ilungiswa, ihamba ngenkqubo yokucoca ngokungqongqo ukususa ukungcola kunye nokuphucula ukusebenza kwayo. Le nkqubo yokucoca iqinisekisa ukuba izibane zesibane se-LED zibonelela ngokuqaqamba okuphezulu, ukuhambelana kombala, kunye nokusebenza kakuhle xa zisetyenziswa. Emva kokuhlanjululwa, izinto eziphathekayo zisikwa zibe ngamaqhekeza amancinci usebenzisa i-cutter advanced.
Isinyathelo esilandelayo kwinkqubo yokuvelisa ibandakanya ukudalwa kwee-chips ze-LED ngokwazo. Ii-wafers ziphathwa ngononophelo kunye neekhemikhali ezithile kwaye zingena kwinkqubo ebizwa ngokuba yi-epitaxy, apho iileyiti zezinto ze-semiconductor zifakwe kumphezulu we-wafer. Oku kubekwa kwenziwa kwindawo elawulwayo kusetyenziswa ubuchule obufana nesinyithi-organic chemical deposition deposition (MOCVD) okanye i-molecular beam epitaxy (MBE).
Emva kokuba inkqubo ye-epitaxial igqityiwe, i-wafer kufuneka ihambe ngoluhlu lwe-photolithography kunye namanyathelo e-etching ukuchaza isakhiwo se-LED. Ezi nkqubo zibandakanya ukusetyenziswa kweendlela eziphambili zefotografi ukwenza iipateni ezinzima kumphezulu we-wafer echaza amacandelo ahlukeneyo e-chip ye-LED, njengemimandla ye-p kunye nohlobo lwe-n, iileya ezisebenzayo, kunye neepads zoqhagamshelwano.
Emva kokuba iichips ze-LED zenziwe, zihamba ngenkqubo yokuhlela kunye nokuvavanya ukuqinisekisa umgangatho kunye nokusebenza kwazo. Itshiphu ivavanyelwa iimpawu zombane, ukuqaqamba, ubushushu bombala, kunye nezinye iiparamitha ukuhlangabezana nemigangatho efunekayo. Iichips ezineziphene zilungiswa ngelixa iitshiphusi ezisebenzayo zisiya kwinqanaba elilandelayo.
Kwinqanaba lokugqibela lemveliso, iitshiphusi ze-LED zipakishwe kwiintsimbi zokugqibela zesibane se-LED. Inkqubo yokupakisha ibandakanya ukunyuswa kwee-chips kwisakhelo esikhokelayo, ukudibanisa kuqhagamshelwano lombane, kwaye udibanise kwizinto ezikhuselayo ze-resin. Le phakheji ikhusela i-chip kwizinto ezisingqongileyo kwaye yandisa ukuqina kwayo.
Emva kokupakishwa, iintsimbi zesibane se-LED ziphantsi kovavanyo olongezelelweyo olusebenzayo, ukuqina, kunye nokuthembeka. Ezi mvavanyo zilinganisa iimeko zokusebenza zokwenyani zokuqinisekisa ukuba amaso esibane se-LED asebenza ngokuzinzileyo kwaye anokumelana nezinto ezahlukeneyo zokusingqongileyo ezifana nokuguquguquka kobushushu, ukufuma kunye nokungcangcazela.
Ngokubanzi, inkqubo yokuvelisa izibane ze-LED zinzima kakhulu, zifuna oomatshini abaphambili, ulawulo oluchanekileyo, kunye nokuhlolwa okungqongqo komgangatho. Ukuqhubela phambili kwitekhnoloji ye-LED kunye nokulungiswa kweenkqubo zokuvelisa kube negalelo elikhulu ekwenzeni izisombululo zezibane ze-LED zibe namandla ngakumbi, zizinzileyo kwaye zithembekile. Ngophando oluqhubekayo kunye nophuhliso kule ntsimi, inkqubo yokuvelisa ilindeleke ukuba iphuculwe ngakumbi, kwaye izibane ze-LED ziya kusebenza ngakumbi kwaye zifikeleleke kwixesha elizayo.
Ukuba unomdla kwinkqubo yokuvelisa amaso isibane LED, wamkelekile ukuba uqhagamshelane LED umenzi ukukhanya esitratweni TIANXIANG ukubaFunda ngokugqithisileyo.
Ixesha lokuposa: Aug-16-2023